Standard units come complete with high flow bottom fill system, top spray manifolds with nozzles, and retractable cover. Other options available include: serrated inner overflow tank, N2 agitation, resistivity sensor and monitor, liquid level sensor, full bottom dump door, perforated bottom plate, DI reclaim, and constant trickle overflow to prevent bacteria build-up in DI water lines. Available with multiple size dump doors for various discharge speeds of DI water. Your choice of material: Polypropylene, PVDF, Teflon, and Stainless Steel. The quick dump rinser can be manufactured to drop into your existing station with minimal or no modification to your deck top or plumbing.
Plating news
- 01/18/2012 STMicroelectronics first to use through-silicon vias for smaller and smarter MEMS chips
- 01/17/2012 Karl's Tech Talk: Wafer Bumping Technology Choices
- 01/16/2012 Baolab intros eval kits for CMOS-integrated MEMS tech
- 01/14/2012 Dublin students win Young Scientists for 2012
- 12/31/2011 New Method for Etching GaAs
- 11/22/2011 MEMS APPLICATIONS
- 11/16/2011 Manufacturing and packaging processes for light emitting diodes
- 10/19/2011 Amerimade Technology and Shanghai Sinyang Semiconductor Materials
- 10/19/2011 SVTC, Amerimade Technology and Shanghai Sinyang Semiconductor Materials Form Partnership to Expand Advanced Electroplating
- 10/18/2011 MEMS Industry Group Announces Finalists for MEMS Executive Congress Technology Showcase
- 10/10/2011 MEMS Industry Group Announces Finalists for MEMS Executive Congress Technology Showcase
- 10/05/2011 Jordan Valley Named Among 2011 50 Fastest Growing Companies
- 10/04/2011 LEDs to hit 70% lighting market penetration in Japan
- 09/29/2011 Cypress Introduces New Gen4 TrueTouch Controller Line
- 09/19/2011 Amendments to National Emission Standards for Hazardous Air Pollutants for Area Sources: Plating and Polishing; Federal Register