STATS ChipPAC Expands Through Silicon Via Capabilities with Mid-End Processing
TSV technology an important element of 2.5D and 3D packaging
Singapore – 4/19/2011, United States – 4/18/2011 – STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company” – SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced it is expanding its 300mm Through Silicon Via (TSV) offering with the addition of mid-end manufacturing capabilities.
Read more, visit http://www.statschippac.com/news/newscenter/2011/news04192011.aspx
